10.5445/KSP/1000034759
Burger, Sofie
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
KIT Scientific Publishing
2013
Fatigue
thin film
cantilever bending
damage structure
en
Doctoral thesis
PDF
Open Access
Creative Commons Namensnennung – Nicht kommerziell – Keine Bearbeitungen 3.0 Deutschland
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.